In a recent PR, Graphene Manufacturing Group (GMG) shared that it continues to advance the commercialization of its THERMAL-XR coating system with the product being tested with companies in multiple industries, including on heat sinks for electronics.
Third-party modelling indicates that applying THERMAL-XR to heat sinks can reduce their size by up to 39% while maintaining the same thermal performance, the company highlighted. This reduction could lead to savings in weight and material costs. The technology also lowers the maximum temperature of heat sinks by 23%, improving their efficiency.
GMG said its solution could be used in the growing market of printed circuit boards (PCBs), where THERMAL-XR could be applied to enhance the performance of heat sinks, helping to manage increased heat from higher-density PCBs.
Craig Nicol, GMG CEO, said that heat sinks are a key part of modern electronics but they come with a range of challenges, notably as devices become smaller, faster and more powerful.
“GMG's THERMAL-XR offers a potential solution in heat sink miniaturization, enabling up to 39% size reduction while maintaining thermal performance,” he said.
“This has the potential to not only cut material costs but also unlock new opportunities for compact and efficient electronics designs, addressing the rising thermal management demands of the global printed circuit board market."
